TCS launches Chiplet Engineering Services to boost semiconductor innovation 

announced Wednesday the launch of its Chiplet-based System Engineering Services, targeting companies seeking to accelerate next-generation chip design. The move positions TCS to capitalise on India’s growing semiconductor ambitions as the country pushes to become a global chip manufacturing hub.

The new services help chipmakers design faster and more efficient processors using chiplets—small integrated circuits that serve as building blocks for larger chips. This approach addresses industry bottlenecks in traditional chip scaling methods where shrinking transistors alone no longer delivers sufficient performance improvements.

TCS has already deployed the technology with a North American semiconductor firm, helping streamline the integration of different chip types into unified systems and accelerating delivery of processors to market.

The timing aligns with India’s semiconductor market expansion. Valued at $45-50 billion in 2024-2025, the market is projected to reach $100-110 billion by 2030. The government’s ₹76,000 crore India Semiconductor Mission supports this growth trajectory.

“TCS Chiplet-based System Engineering services will help semiconductor enterprises accelerate chiplets tapeout driving flexibility, scalability and faster time to market,” said V Rajanna, President of Technology, Software and Services at TCS.

The services include comprehensive design and verification of industry standards UCIe and HBM, plus advanced package design services covering 2.5D and 3D interposers and multi-layer organic substrates.



The shares of Tata Consultancy Services Limited were trading at ₹3,114 up by ₹ or 0.13 per cent on the at 11.35 am.

More Like This

Source

Leave a Reply

Your email address will not be published. Required fields are marked *