Prime Minister Narendra Modi will inaugurate CG Semi’s ₹7,500-crore Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand on Saturday, marking the commencement of commercial production at one of India’s first semiconductor packaging and testing plants under the India Semiconductor Mission (ISM).
The facility, developed by CG Semi Pvt Ltd in partnership with Japan’s Renesas Electronics and Thailand’s Stars Microelectronics, is among the first four semiconductor projects approved under the India Semiconductor Mission. Once fully ramped up, the Sanand facility will have an annual production capacity of up to 5 billion semiconductor chips and will cater to customers across the automotive, industrial, telecommunications, 5G and Internet of Things (IoT) sectors. The plant will provide end-to-end semiconductor assembly and testing services, including wafer sorting, assembly, testing, package design, failure analysis, test programme development, product characterisation and logistics support.
The Sanand project had reached a key milestone in August 2025, when Electronics and IT Minister Ashwini Vaishnaw inaugurated its pilot line, marking the start of product qualification ahead of commercial production. The project complements the country’s broader semiconductor push, which includes Tata Electronics’ semiconductor fabrication plant at Dholera, Micron Technology’s assembly, testing, marking and packaging (ATMP) facility at Sanand, and OSAT projects being developed by Kaynes Technology India at Sanand.
Speaking at the Gujarat SemiConnect Conference in Gandhinagar in March 2026, CG Semi Chairman G.C. Chaturvedi had said the company completed construction of its first Sanand facility in August 2025 and was preparing to commence commercial production later this year. He had also announced plans for a second facility, expected to become operational in 2027, as part of the company’s long-term expansion strategy.